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The new 3D SPI system for advanced packaging and microelectronics is a newly launch solder paste vision platform that resolve challenging and miniature defects detection with automation & flexibility.
Vitrox - V310i SPI

V310i Series Advanced 3D Solder Paste Inspection (SPI) is designed for paste inspection to increase high throughput productivity in SMT production line.

Key Benefits

  •  High Speed performance SPI system in market
  •  Powerful reporting for data analysis and performance monitoring
  •  Smart Manufacturing Ready
  •  Preferred choice by consumer, automotive, and telecommunication sectors
  •  Shareable wear & tear spare parts between 3D AOI and 3D SPI under one similar machine
  •  Competitive Cost of Ownership



  • Details
  • Specifications

The new 3D SPI system for advanced packaging and microelectronics is a newly launch solder paste vision platform that resolve challenging and miniature defects detection with automation & flexibility.

System SPI for Advanced Packaging
Inspection Capabilities Missing, XY Offset, Height, Area, Volume, Bridge and Micro Bridge.
Extended Capabilities: Leadframe Inspection, Solder Bump Inspection, SiP Inspection
Board Level Traceability Camera-Read Barcodes; External Barcode Reader Configured
System Hardware 25MP
Operating System Windows 10 (64-bit)
Optical Resolution & FOV Size 22.5mmx22.5mm @ 4.5μm telecentric lens
Inspection Speed 25MP CoaXPress @ 4.5µm Resolution: 7-15cm²/sec
3D Technologies Phase Shift Profilometry’s (PSP) Methodology
Lighting Module Multi-Segment LED Lighting
Board Dimension  
Maximum Board Size (L x W) 470mmx500mm (18.5"x19.6")
Minimum Board Size (L x W) 50mmx50mm (2"x2")
Maximum Board Thickness 4mm (0.15")
Minimum Board Thickness 0.2mm (0.00787")
Maximum PCB Weight 3kg
Top Clearance of PCB 10mm
Bottom clearance of PCB 70mm
PCB Edge Clearance 3.5mm
PCB Transport Height 875mm-965mm
PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C.

 

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